Product Name: Module board

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Specifications

Layer count：4

Board thickness：1.2m

Base materials：FR4 S1141

Finished size：144*132mm

Surface finish：Lead-free tin

Line width/line space：6/6mil

Minimum hole：0.30mm

Solder resist color：Sensitive green

Cu thickness：inner layer 1 OZ outer layer 1 OZ

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Characteristic

1, on four sides of the board with metallized semi hole design, the product of small aperture, hole spacing is small, semi hole Banduo for Bluetooth module, security monitoring module;

2, in the process of PCB production process need to design special processes to protect the plate edge of the semi hole metallization, and no metal burr;

3, due to the production process is longer, usually relatively ordinary plate of the delivery period will be slightly extended 1--2 days;

4, with a half hole design of the board can not do the gold plating process, you can choose heavy gold, tin lead tin, lead-free tin spraying.