Product Name: Handheld electronic board

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Specifications

Layer count：8

Board thickness：1.2mm

Base materials：FR4 S1000-2

Finished size：205*145mm

Surface finish：沉金+OSP

Line width/line space：3/3mil

Minimum hole：0.10mm

Solder resist color：Sensitive green

Cu thickness：inner layer H OZ outer layer 1 OZ

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Characteristic

1, the structure is complex, the two order HDI:

Blind hole L1-L2, L7-L8

Buried hole L2-L3, L3-L6, L6-L7

Through hole L1-L8

2, multiple pressure and copper;

3, the need for laser drilling blind hole;

4, the line spacing is small, etching difficult;

5, pressure, line, high precision drilling requirements;

6, multiple thin copper surface.