Product Name: Communication equipment board

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Specifications

Layer count：8

Board thickness：1.0mm

Base materials：FR4 S1000-2

Finished size：290*216mm

Surface finish：Lead-free tin

Line width/line space：3/3mil

Minimum hole：0.10mm

Solder resist color：Sensitive blue

Cu thickness：inner layer 1 OZ outer layer 1 OZ

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Characteristic

Blind hole design, complex structure, two order HDI, blind hole L1-L2, L7-L8, buried hole L2-L3, L3-L6, L6-L7, through hole L1-L8