Product Name: Handheld electronic board

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Specifications

Layer count：6

Board thickness：1.0mm

Base materials：FR4 S1000-2

Finished size：212*170mm

Surface finish：Gold+OSP

Line width/line space：3/3mil

Minimum hole：0.10mm

Solder resist color：Sensitive Blue

Cu thickness：inner layer 1 OZ outer layer 1 OZ

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Characteristic

1, the structure is complex, first order HDI:

Blind hole L1-L2, L5-L6

Buried L2-L5

Through hole L1-L8

2, multiple pressure and copper;

3, the need for laser drilling blind hole;

4, the line spacing is small, etching difficult;

5, pressure, line, high precision drilling requirements;

6, multiple thin copper surface.